Extruded board-level heat sinks vary in size depending on the application and can be designed for passive or active cooling based on fin shape and pitch. Board-level extruded heat sinks are common in packages such as BGAs and FPGAs. Board-level heat sinks are used extensively in daily production and life. Board-level heat sinks can be stamped or extruded. Stamped board-level heat sinks are made of sheet metal that has gone through a progressive stamping process, where details and features are added to each metal stamping as it passes through the stamping die.
Board-level heat sinks are used extensively in daily production and life. Board-level heat sinks can be stamped or extruded. Stamped board-level heat sinks are made of sheet metal that has gone through a progressive stamping process, where details and features are added to each metal stamping as it passes through the stamping die.
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